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FOUP Cleaner

Process Application
- 300 mm FOUP Cleaning
- All FOUP applications (Shinetsu, Entergrise etc.)
- NFC300(Normal), VFC300 & VFC301(Vacuum)
System Performance
- Separate cleaning of FOUP Body and FOUP
- Spin RPM: Body 0~10 RPM, Cover 0~400 RPM
- 2(Body) x 2(Cover) Cleaning Chambers
- Nozzle: High pressure spray
- Hot DI Cleaning & Hot CDA Drying
- N₂ Purge & Close system
- UPEH: 21 FOUPs/hour
The Merits
- Small Footprint (the smallest area in the world)
- High throughput, N₂ Purge & Close system
Robot
- X-Y-Z-R Axis Robot
- Auto Tilting, High Power, Fast Speed

NEW FOUP Cleaner

Process Application
- 300 mm FOUP Cleaning
- All FOUP applications (Shinetsu, Entergrise etc.)
- VFC310 (New Vacuum)
System Performance
- Separate cleaning of FOUP Body and FOUP
- Spin RPM: Body 0~10 RPM, Cover 0~400 RPM
- 3(Body) x 3(Cover) Cleaning Chambers
- Nozzle: High pressure spray
- Hot DI Cleaning & Hot CDA Drying
- N₂ Purge & Close system
- UPEH: 28 FOUPs/hour
The Merits
- Small Footprint (the smallest area in the world)
- High throughput, N₂ Purge & Close system
Robot
- 6-Axis Multi-joint Robot
- Auto Tilting, High Power, Fast Speed

FOUP Inspection System

Purpose
- FOUP Appearance and Internal Inspection
- Damage detection and dimensional inspection, such as breakage, imprinting, and wafer powder
The Merits
-Combined with FOUP Cleaner at Buyer’s request
- Improved detection power through Image Processing
Category Items to Inspect
FOUP Inside
  • - Wafer Removed
  • - Slot Pitch, Width
  • - Damage, Pieces of Broken Wafer
FOUP Door
  • - Retainer Tips Damage, Pitch
  • - Gasket Damage, Position
FOUP Top
  • - Handling Flange Missing Screw
  • - Flange Damage
FOUP Bottom
  • - Missing Screw
  • - Broken, Crack, Damage
FOUP Side
  • - Side · Handle Damage
  • - Fixed Latch Damage